Intel has released its Extensible Host Controller Interface (xHCI) draft specification for USB 3.0 devices. USB 3.0, also known as SuperSpeed USB, is a next-generation high-speed connection standard due in 2009 offerring data trasfer speed 10 times faster thanĀ  the current USB 2.0.

The objective of the draft specificationis to create an industry standard that will allow chipset makers to develop devices that can communicate with USB 3.0 system software. Also, the specification revision 0.9 resolves the dispute with Nvidia, AMD, VIA and others who are threatening to co-develop a more open USB 3.0 standard.

“Interoperability among devices from multiple manufacturers is important for consumer adoption of SuperSpeed USB products,” Intel said in a statement. The draft specification revision will make it easier to develop software support for the industry, according to Intel.

AMD, Dell, Microsoft, NEC and Nvidia have expressed support for the new draft specification from Intel.

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